AMD XAZU3EG-1SFVA625Q

XAZU3EG-1SFVA625Q


  • Manufacturer: AMD
  • CONEVO NO: XAZU3EG-1SFVA625Q
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XAZU3EG-1SFVA625Q(Kg)

Details

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Parameters
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 1.8MB
Peripherals DMA, WDT
Connectivity CANbus, I²C, SPI, UART/USART, USB
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature -40°C ~ 125°C (TJ)
Package / Case 625-BFBGA, FCBGA
Supplier Device Package 625-FCBGA (21x21)
Number of I/O 128
Base Product Number XAZU3
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 500MHz, 1.2GHz 625-FCBGA (21x21)
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