Parameters | |
---|---|
Series | Spartan®-3A |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
RoHS Status | ROHS3 Compliant |
Package / Case | 484-BBGA |
Mfr | AMD |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Supplier Device Package | 484-FBGA (23x23) |
Number of I/O | 372 |
Voltage - Supply | 1.14V ~ 1.26V |
Number of Gates | 700000 |
Number of Logic Elements/Cells | 13248 |
Number of LABs/CLBs | 1472 |
Total RAM Bits | 368640 |
Package | Tray |
Product Status | Active |
Conevo-Key Programmable | Not Verified |
Base Product Number | XC3S700 |
REACH Status | REACH Unaffected |
Standard Package | 60 |
ECCN | 3A991D |
HTSUS | 8542.39.0001 |
The AMD XC3S700A-4FGG484I is an FPGA (Field Programmable Gate Array) device manufactured by AMD, which is now part of Xilinx's product line. This specific model
is designed for high-performance applications and comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates over a wide temperature range of -40°C to
+100°C, making it suitable for both commercial and industrial environments. The XC3S700A-4FGG484I is equipped with a total of 13248 logic cells and 1472 logic array
blocks (LABs), offering a substantial amount of programmable resources for complex digital designs. It also features 372 I/O pins, 368640 bits of total RAM, and a gate
count of 700000, providing flexibility for various interface and processing requirements. The device is powered within a voltage range of 1.14V to 1.26V, ensuring reliable
operation across different power supply conditions.
XC3S700A-4FGG484I Features:
High-density FPGA with 13248 logic cells and 1472 LABs for complex programmable logic designs.
484-pin FBGA package for high I/O count applications.
Wide operating temperature range from -40°C to +100°C, suitable for diverse environments.
372 I/O pins for extensive connectivity options.
368640 bits of total RAM and a gate count of 700000 to handle large-scale projects.
Operates on a supply voltage between 1.14V and 1.26V for reliable power efficiency.
XC3S700A-4FGG484I Applications:
The AMD / Xilinx XC3S700A-4FGG484I FPGA is utilized in a variety of advanced applications that demand high performance and flexibility. It is commonly used in:
Digital signal processing where high-speed data manipulation is required.
Telecommunications equipment that needs to handle multiple and varied signal protocols.
Industrial control systems where programmable logic can automate and control complex processes.
Military and aerospace systems that require reliable operation over a wide temperature range and in harsh conditions.
High-speed serial interfaces and networking applications that benefit from the device's extensive I/O capabilities.