AMD XC3SD3400A-4FGG676C

XC3SD3400A-4FGG676C


  • Manufacturer: AMD
  • CONEVO NO: XC3SD3400A-4FGG676C
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC3SD3400A-4FGG676C(Kg)

Details

Tags

Parameters
Mfr AMD
Series Spartan®-3A DSP
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 5968
Number of Logic Elements/Cells 53712
Total RAM Bits 2322432
Number of I/O 469
Number of Gates 3400000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC3SD3400
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 40
Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 469 2322432 53712 676-BGA
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