AMD XC7Z035-1FBG676C

XC7Z035-1FBG676C


  • Manufacturer: AMD
  • CONEVO NO: XC7Z035-1FBG676C
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC7Z035-1FBG676C(Kg)

Details

Tags

Parameters
Mfr AMD
Series Zynq®-7000
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z035
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 1
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 667MHz 676-FCBGA (27x27)
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