Parameters |
Product Status |
Active |
Architecture |
MCU, FPGA |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size |
- |
RAM Size |
256KB |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed |
800MHz |
Primary Attributes |
Kintex™-7 FPGA, 444K Logic Cells |
Operating Temperature |
-40°C ~ 100°C (TJ) |
Package / Case |
900-BBGA, FCBGA |
Supplier Device Package |
900-FCBGA (31x31) |
Number of I/O |
212 |
Base Product Number |
XC7Z100 |
RoHS Status |
Not applicable |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
REACH Status |
REACH Unaffected |
ECCN |
3A991D |
HTSUS |
8542.39.0001 |
Standard Package |
1 |
Mfr |
AMD |
Series |
Zynq®-7000 |
Package |
Tray |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 800MHz 900-FCBGA (31x31)