AMD XCKU19P-3FFVB2104E

XCKU19P-3FFVB2104E


  • Manufacturer: AMD
  • CONEVO NO: XCKU19P-3FFVB2104E
  • Package: 2104-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCKU19P-3FFVB2104E(Kg)

Details

Tags

Parameters
Mfr AMD
Series Virtex® UltraScale+™
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 105300
Number of Logic Elements/Cells 1842750
Total RAM Bits 63753421
Number of I/O 540
Voltage - Supply 0.873V ~ 0.927V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (47.5x47.5)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Other Names 122-XCKU19P-3FFVB2104E
Standard Package 1
Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 540 63753421 1842750 2104-BBGA, FCBGA
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