AMD XCKU3P-1FFVD900E

XCKU3P-1FFVD900E


  • Manufacturer: AMD
  • CONEVO NO: XCKU3P-1FFVD900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCKU3P-1FFVD900E(Kg)

Details

Tags

Parameters
Mfr AMD
Series Kintex® UltraScale+™
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 304
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XCKU3
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A991D
HTSUS 8542.39.0001
Other Names 122-2038
Standard Package 1
Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 31641600 355950 900-BBGA, FCBGA
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