AMD XCKU3P-L1SFVB784I

XCKU3P-L1SFVB784I


  • Manufacturer: AMD
  • CONEVO NO: XCKU3P-L1SFVB784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCKU3P-L1SFVB784I(Kg)

Details

Tags

Parameters
Mfr AMD
Series Kintex® UltraScale+™
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 256
Voltage - Supply 0.698V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 784-BFBGA, FCBGA
Supplier Device Package 784-FCBGA (23x23)
Base Product Number XCKU3
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 5A002A1
HTSUS 8542.39.0001
Standard Package 1
Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 256 31641600 355950 784-BFBGA, FCBGA
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