AMD XCVC1702-1LSENSVG1369
| Parameters | |
|---|---|
| Mfr | AMD |
| Series | Versal™ AI Core |
| Package | Tray |
| Product Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 1369-BFBGA |
| Supplier Device Package | 1369-BGA (35x35) |
| Number of I/O | 500 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| ECCN | 3A001A7B |
| HTSUS | 8542.39.0001 |
| Other Names | 122-XCVC1702-1LSENSVG1369 |
| Standard Package | 1 |
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 1369-BGA (35x35)
