AMD XCVC1702-1LSIVSVA2197

XCVC1702-1LSIVSVA2197


  • Manufacturer: AMD
  • CONEVO NO: XCVC1702-1LSIVSVA2197
  • Package: 2197-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCVC1702-1LSIVSVA2197(Kg)

Details

Tags

Parameters
Mfr AMD
Series Versal™ AI Core
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 400MHz, 1GHz
Primary Attributes Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 2197-BFBGA, FCBGA
Supplier Device Package 2197-FCBGA (45x45)
Number of I/O 608
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN 3A001A7B
HTSUS 8542.39.0001
Other Names 122-XCVC1702-1LSIVSVA2197
Standard Package 1
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 2197-FCBGA (45x45)
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