AMD XCVC1702-1MLINSVG1369
| Parameters | |
|---|---|
| Mfr | AMD |
| Series | Versal™ AI Core |
| Package | Tray |
| Product Status | Active |
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Package / Case | 1369-BFBGA, FCBGA |
| Supplier Device Package | 1369-FCBGA (35x35) |
| Number of I/O | 500 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Other Names | 122-XCVC1702-1MLINSVG1369 |
| Standard Package | 1 |
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 600MHz, 1.3GHz 1369-FCBGA (35x35)
