AMD XCZU3EG-3SFVC784E

XCZU3EG-3SFVC784E


  • Manufacturer: AMD
  • CONEVO NO: XCZU3EG-3SFVC784E
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCZU3EG-3SFVC784E(Kg)

Details

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Parameters
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Product Status Obsolete
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 667MHz, 1.5GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 784-BFBGA, FCBGA
Supplier Device Package 784-FCBGA (23x23)
Number of I/O 252
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
HTSUS 8542.39.0001
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 600MHz, 667MHz, 1.5GHz 784-FCBGA (23x23)
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