AMD XCZU46DR-2FFVH1760E

XCZU46DR-2FFVH1760E


  • Manufacturer: AMD
  • CONEVO NO: XCZU46DR-2FFVH1760E
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCZU46DR-2FFVH1760E(Kg)

Details

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Parameters
Mfr AMD
Series Zynq® UltraScale+™ RFSoC
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.333GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Number of I/O 574
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCZU46DR-2FFVH1760E
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 533MHz, 1.333GHz 1760-FCBGA (42.5x42.5)
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