AMD XCZU47DR-L2FFVE1156I

XCZU47DR-L2FFVE1156I


  • Manufacturer: AMD
  • CONEVO NO: XCZU47DR-L2FFVE1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCZU47DR-L2FFVE1156I(Kg)

Details

Tags

Parameters
Mfr AMD
Series Zynq® UltraScale+™ RFSoC
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.333GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 366
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCZU47DR-L2FFVE1156I
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 533MHz, 1.333GHz 1156-FCBGA (35x35)
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