AMD XCZU57DR-L2FFVE1156I

XCZU57DR-L2FFVE1156I


  • Manufacturer: AMD
  • CONEVO NO: XCZU57DR-L2FFVE1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCZU57DR-L2FFVE1156I(Kg)

Details

Tags

Parameters
Mfr AMD
Series Zynq® UltraScale+™ RFSoC DR
Package Tray
Product Status Active
Architecture MPU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
RAM Size -
Peripherals DDR, DMA, PCIe, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
Primary Attributes Zynq® UltraScale+™ RFSoC
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O -
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Other Names 122-XCZU57DR-L2FFVE1156I
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC DR Zynq® UltraScale+™ RFSoC 533MHz, 1.3GHz 1156-FCBGA (35x35)
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