AMD XCZU9EG-L1FFVC900I

XCZU9EG-L1FFVC900I


  • Manufacturer: AMD
  • CONEVO NO: XCZU9EG-L1FFVC900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XCZU9EG-L1FFVC900I(Kg)

Details

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Parameters
Mfr AMD
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Product Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU9
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.31.0001
Standard Package 1
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)
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