Parameters |
Mfr |
Analog Devices Inc./Maxim Integrated |
Series |
- |
Package |
Tray |
Product Status |
Obsolete |
Function |
TDM-over-Packet (TDMoP) |
Interface |
TDMoP |
Number of Circuits |
1 |
Voltage - Supply |
1.8V, 3.3V |
Current - Supply |
- |
Operating Temperature |
-40°C ~ 85°C |
Mounting Type |
Surface Mount |
Package / Case |
676-BGA |
Supplier Device Package |
676-TEPBGA (27x27) |
Base Product Number |
DS34S132 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8542.39.0001 |
Standard Package |
1 |
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)