Analog Devices Inc./Maxim Integrated DS34S132GN

DS34S132GN


  • Manufacturer: Analog Devices Inc./Maxim Integrated
  • CONEVO NO: DS34S132GN
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr Analog Devices Inc./Maxim Integrated
Series -
Package Tray
Product Status Obsolete
Function TDM-over-Packet (TDMoP)
Interface TDMoP
Number of Circuits 1
Voltage - Supply 1.8V, 3.3V
Current - Supply -
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 676-BGA
Supplier Device Package 676-TEPBGA (27x27)
Base Product Number DS34S132
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 1
Telecom IC TDM-over-Packet (TDMoP) 676-TEPBGA (27x27)
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