Epson Electronics America Inc-Semiconductor Div S1C17M23F002100

S1C17M23F002100


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C17M23F002100
  • Package: 32-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1C17M23F002100(Kg)

Details

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Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor S1C17
Core Size 16-Bit
Speed 21MHz
Connectivity I²C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Data Converters A/D 12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 32-VFQFN Exposed Pad
Supplier Device Package 32-SQFN5 (5x5)
Other Names 502-S1C17M23F002100
Standard Package 490
S1C17 - Microcontroller IC 16-Bit 21MHz 32KB (32K x 8) FLASH 32-SQFN5 (5x5)
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