Epson Electronics America Inc-Semiconductor Div S1C17M30F001100-250

S1C17M30F001100-250


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C17M30F001100-250
  • Package: 48-TQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1C17M30F001100-250(Kg)

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Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor S1C17
Core Size 16-Bit
Speed 17.12MHz
Connectivity I²C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
Number of I/O 37
Program Memory Size 48KB (48K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Data Converters A/D 3x12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 48-TQFP
Supplier Device Package 48-TQFP12 (7x7)
Other Names 502-S1C17M30F001100-250
Standard Package 250
S1C17 - Microcontroller IC 16-Bit 17.12MHz 48KB (48K x 8) FLASH 48-TQFP12 (7x7)
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