Epson Electronics America Inc-Semiconductor Div S1C17W04F101100-250

S1C17W04F101100-250


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C17W04F101100-250
  • Package: 48-TQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1C17W04F101100-250(Kg)

Details

Tags

Parameters
Product Status Active
Core Processor S1C17
Core Size 16-Bit
Speed 4.2MHz
Connectivity I²C, IrDA, SSI, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 34
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V
Data Converters A/D 6x12b SAR
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 48-TQFP
Supplier Device Package 48-TQFP (7x7)
Base Product Number S1C17W04
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 250
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
S1C17 - Microcontroller IC 16-Bit 4.2MHz 32KB (32K x 8) FLASH 48-TQFP (7x7)
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