Epson Electronics America Inc-Semiconductor Div S1C17W15F005100

S1C17W15F005100


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C17W15F005100
  • Package: Die
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1C17W15F005100(Kg)

Details

Tags

Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor S1C17
Core Size 16-Bit
Speed 4.2MHz
Connectivity I²C, IrDA, SPI, UART/USART
Peripherals LCD, POR, PWM, RFC, SNDA, WDT
Number of I/O 32
Program Memory Size 64KB (64K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Base Product Number S1C17W15
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 160
S1C17 - Microcontroller IC 16-Bit 4.2MHz 64KB (64K x 8) FLASH Die
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