Epson Electronics America Inc-Semiconductor Div S1C17W23F101100-90

S1C17W23F101100-90


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C17W23F101100-90
  • Package: 128-TQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1C17W23F101100-90(Kg)

Details

Tags

Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor S1C17
Core Size 16-Bit
Speed 4.2MHz
Connectivity I²C, IrDA, SPI, UART/USART
Peripherals LCD, PWM, RFC, WDT
Number of I/O 41
Program Memory Size 96KB (96K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 128-TQFP
Supplier Device Package 128-TQFP15 (14x14)
Base Product Number S1C17W23
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 90
S1C17 - Microcontroller IC 16-Bit 4.2MHz 96KB (96K x 8) FLASH 128-TQFP15 (14x14)
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