Epson Electronics America Inc-Semiconductor Div S1C31D01B10210B

S1C31D01B10210B


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C31D01B10210B
  • Package: 96-WFBGA, WLCSP
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1C31D01B10210B(Kg)

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Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+
Core Size 32-Bit
Speed 21MHz
Connectivity I²C, IrDA, QSPI, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
Number of I/O 57
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 96K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Data Converters A/D 8x12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 96-WFBGA, WLCSP
Supplier Device Package 96-WLCSP (4.45x4.45)
Other Names 502-S1C31D01B10210B
Standard Package 3,000
ARM® Cortex®-M0+ - Microcontroller IC 32-Bit 21MHz 256KB (256K x 8) FLASH 96-WLCSP (4.45x4.45)
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