Epson Electronics America Inc-Semiconductor Div S1C31W74B201000

S1C31W74B201000


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1C31W74B201000
  • Package: 181-VFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1C31W74B201000(Kg)

Details

Tags

Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+
Core Size 32-Bit Single-Core
Speed 21MHz
Connectivity I²C, IrDA, QSPI, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O 71
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters -
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 181-VFBGA
Supplier Device Package 181-VFBGA (8x8)
Base Product Number S1C31W74
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 348
ARM® Cortex®-M0+ - Microcontroller IC 32-Bit Single-Core 21MHz 512KB (512K x 8) FLASH 181-VFBGA (8x8)
Contact Information
close