Epson Electronics America Inc-Semiconductor Div S1D13717B00B100

S1D13717B00B100


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1D13717B00B100
  • Package: 160-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: S1D13717B00B100(Kg)

Details

Tags

Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Obsolete
Function Graphics Engine
Applications Video Display
Standards -
Control Interface -
Voltage - Supply 1.8V ~ 3V
Mounting Type Surface Mount
Package / Case 160-TFBGA
Supplier Device Package 160-PFBGA (10x10)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 168
Video Graphics Engine IC 160-PFBGA (10x10) Package
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