Epson Electronics America Inc-Semiconductor Div S1D15710D11B000

S1D15710D11B000


  • Manufacturer: Epson Electronics America Inc-Semiconductor Div
  • CONEVO NO: S1D15710D11B000
  • Package: Die
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr Epson Electronics America Inc-Semiconductor Div
Series -
Package Tray
Product Status Not For New Designs
Function -
Applications -
Standards -
Control Interface -
Voltage - Supply -
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Chip
Base Product Number S1D15710
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 48
Video IC Chip Package
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