Everspin Technologies Inc. EM016LXQADG13IS1R

EM016LXQADG13IS1R


  • Manufacturer: Everspin Technologies Inc.
  • CONEVO NO: EM016LXQADG13IS1R
  • Package: 8-VDFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: EM016LXQADG13IS1R(Kg)

Details

Tags

Parameters
Mfr Everspin Technologies Inc.
Series EMxxLX
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format RAM
Technology MRAM (Magnetoresistive RAM)
Memory Size 16Mbit
Memory Organization 2M x 8
Memory Interface SPI - Octal I/O
Clock Frequency 200 MHz
Write Cycle Time - Word, Page -
Voltage - Supply 1.65V ~ 2V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 8-VDFN Exposed Pad
Supplier Device Package 8-DFN (6x8)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.32.0071
Other Names 819-EM016LXQADG13IS1RTR
Standard Package 2,000
MRAM (Magnetoresistive RAM) Memory IC 16Mbit SPI - Octal I/O 200 MHz 8-DFN (6x8)
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