Everspin Technologies Inc. MR25H10MDCR

MR25H10MDCR


  • Manufacturer: Everspin Technologies Inc.
  • CONEVO NO: MR25H10MDCR
  • Package: 8-TDFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MR25H10MDCR(Kg)

Details

Tags

Parameters
Mfr Everspin Technologies Inc.
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
Product Status Not For New Designs
Memory Type Non-Volatile
Memory Format RAM
Technology MRAM (Magnetoresistive RAM)
Memory Size 1Mbit
Memory Organization 128K x 8
Memory Interface SPI
Clock Frequency 40 MHz
Write Cycle Time - Word, Page -
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-TDFN Exposed Pad
Supplier Device Package 8-DFN-EP, Large Flag (5x6)
Base Product Number MR25H10
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0071
Standard Package 4,000
MRAM (Magnetoresistive RAM) Memory IC 1Mbit SPI 40 MHz 8-DFN-EP, Large Flag (5x6)
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