Flexxon Pte Ltd FEMC032GBA-T740

FEMC032GBA-T740


  • Manufacturer: Flexxon Pte Ltd
  • CONEVO NO: FEMC032GBA-T740
  • Package: 153-VFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: FEMC032GBA-T740(Kg)

Details

Tags

Parameters
Mfr Flexxon Pte Ltd
Series XTRA VIII
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (TLC)
Memory Size 256Gbit
Memory Organization 32G x 8
Memory Interface eMMC_5.1
Clock Frequency 200 MHz
Write Cycle Time - Word, Page -
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 153-VFBGA
Supplier Device Package 153-FBGA (11.5x13)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 3052-FEMC032GBA-T740
Standard Package 1
FLASH - NAND (TLC) Memory IC 256Gbit eMMC_5.1 200 MHz 153-FBGA (11.5x13)
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