Flexxon Pte Ltd FEMC032GBE-TC40

FEMC032GBE-TC40


  • Manufacturer: Flexxon Pte Ltd
  • CONEVO NO: FEMC032GBE-TC40
  • Package: 153-VFBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Mfr Flexxon Pte Ltd
Series -
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (TLC)
Memory Size 256Gbit
Memory Organization 32G x 8
Memory Interface eMMC
Write Cycle Time - Word, Page -
Voltage - Supply -
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 153-VFBGA
Supplier Device Package 153-FBGA (11.5x13)
Base Product Number FEMC032
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Names 3052-FEMC032GBE-TC40
Standard Package 1
FLASH - NAND (TLC) Memory IC 256Gbit eMMC 153-FBGA (11.5x13)
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