GigaDevice Semiconductor (HK) Limited GD25LE128ESIGR

GD25LE128ESIGR


  • Manufacturer: GigaDevice Semiconductor (HK) Limited
  • CONEVO NO: GD25LE128ESIGR
  • Package: 8-SOIC (0.209", 5.30mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: GD25LE128ESIGR(Kg)

Details

Tags

Parameters
Mfr GigaDevice Semiconductor (HK) Limited
Series -
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR (SLC)
Memory Size 128Mbit
Memory Organization 16M x 8
Memory Interface SPI - Quad I/O, QPI
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 60µs, 2.4ms
Access Time 6 ns
Voltage - Supply 1.65V ~ 2V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package 8-SOP
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Standard Package 2,000
FLASH - NOR (SLC) Memory IC 128Mbit SPI - Quad I/O, QPI 133 MHz 6 ns 8-SOP
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