GigaDevice Semiconductor (HK) Limited GD25LQ256DYIGR

GD25LQ256DYIGR


  • Manufacturer: GigaDevice Semiconductor (HK) Limited
  • CONEVO NO: GD25LQ256DYIGR
  • Package: 8-WDFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: GD25LQ256DYIGR(Kg)

Details

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Parameters
Mfr GigaDevice Semiconductor (HK) Limited
Series -
Package Tape & Reel (TR)
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 256Mbit
Memory Organization 32M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 120 MHz
Write Cycle Time - Word, Page 2.4ms
Voltage - Supply 1.65V ~ 2V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (6x8)
Base Product Number GD25LQ256
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Standard Package 3,000
FLASH - NOR Memory IC 256Mbit SPI - Quad I/O 120 MHz 8-WSON (6x8)
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