Infineon Technologies C165L25MHABXUMA1

C165L25MHABXUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: C165L25MHABXUMA1
  • Package: 100-BQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: C165L25MHABXUMA1(Kg)

Details

Tags

Parameters
Package / Case 100-BQFP
Supplier Device Package P-MQFP-100
Base Product Number C165L25
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Other Names SP000011594
Standard Package 500
Mfr Infineon Technologies
Series C16xx
Package Tape & Reel (TR)
Product Status Obsolete
Core Processor C166
Core Size 16-Bit
Speed 25MHz
Connectivity EBI/EMI, SPI, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 77
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V
Data Converters -
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
C166 C16xx Microcontroller IC 16-Bit 25MHz ROMless P-MQFP-100
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