Infineon Technologies CY62147G18-55ZSXI

CY62147G18-55ZSXI


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CY62147G18-55ZSXI
  • Package: 44-TSOP (0.400", 10.16mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: CY62147G18-55ZSXI(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series MoBL®
Package Tray
Product Status Active
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Asynchronous
Memory Size 4Mbit
Memory Organization 256K x 16
Memory Interface Parallel
Write Cycle Time - Word, Page 55ns
Access Time 55 ns
Voltage - Supply 1.65V ~ 2.2V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 44-TSOP (0.400", 10.16mm Width)
Supplier Device Package 44-TSOP II
Base Product Number CY62147
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Standard Package 270
SRAM - Asynchronous Memory IC 4Mbit Parallel 55 ns 44-TSOP II
Contact Information
close