Infineon Technologies CY62177GE30-55ZXI

CY62177GE30-55ZXI


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CY62177GE30-55ZXI
  • Package: 48-TFSOP (0.724", 18.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: CY62177GE30-55ZXI(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series MoBL®
Package Tray
Product Status Active
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Asynchronous
Memory Size 32Mbit
Memory Organization 2M x 16
Memory Interface Parallel
Write Cycle Time - Word, Page 55ns
Access Time 55 ns
Voltage - Supply 2.2V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP I
RoHS Status ROHS3 Compliant
ECCN 3A991B2A
HTSUS 8542.32.0041
Standard Package 480
SRAM - Asynchronous Memory IC 32Mbit Parallel 55 ns 48-TSOP I
Contact Information
close