Infineon Technologies CY7C2165KV18-550BZXC

CY7C2165KV18-550BZXC


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CY7C2165KV18-550BZXC
  • Package: 165-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: CY7C2165KV18-550BZXC(Kg)

Details

Tags

Parameters
Package / Case 165-LBGA
Supplier Device Package 165-FBGA (13x15)
Base Product Number CY7C2165
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Standard Package 136
Mfr Infineon Technologies
Series -
Package Tray
Product Status Active
Memory Type Volatile
Memory Format SRAM
Technology SRAM - Synchronous, QDR II+
Memory Size 18Mbit
Memory Organization 512K x 36
Memory Interface Parallel
Clock Frequency 550 MHz
Write Cycle Time - Word, Page -
Voltage - Supply 1.7V ~ 1.9V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
SRAM - Synchronous, QDR II+ Memory IC 18Mbit Parallel 550 MHz 165-FBGA (13x15)
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