Infineon Technologies CY9DF566MGBEQ-GTE1

CY9DF566MGBEQ-GTE1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CY9DF566MGBEQ-GTE1
  • Package: 208-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: CY9DF566MGBEQ-GTE1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series Traveo MB9D560
Package Tray
Product Status Discontinued at Digi-Key
Core Processor ARM® Cortex®-R5F
Core Size 32-Bit Single-Core
Speed 200MHz
Connectivity CANbus, CSIO, FlexRay, LINbus, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT
Number of I/O 125
Program Memory Size 2.25MB (2.25M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 5.5V
Data Converters A/D 40x12b; D/A 2x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 208-LQFP Exposed Pad
Supplier Device Package 208-TEQFP (28x28)
Base Product Number CY9DF566
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
HTSUS 0000.00.0000
Other Names MB9DF566MGBEQ-GTE1
Standard Package 1
ARM® Cortex®-R5F Traveo MB9D560 Microcontroller IC 32-Bit Single-Core 200MHz 2.25MB (2.25M x 8) FLASH 208-TEQFP (28x28)
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