Infineon Technologies CYT3DLABHBQ1AESGS

CYT3DLABHBQ1AESGS


  • Manufacturer: Infineon Technologies
  • CONEVO NO: CYT3DLABHBQ1AESGS
  • Package: 216-QFP
  • Datasheet: -
  • Stock: In stock
  • Description: CYT3DLABHBQ1AESGS(Kg)

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Mfr Infineon Technologies
Series Traveo™ T2G
Package Tray
Product Status Active
Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M7F
Core Size 32-Bit Dual-Core
Speed 240MHz
Connectivity CANbus, Ethernet, LINbus, SPI
Peripherals DMA, I²S, LVD, Temp Sensor, WDT
Number of I/O 108
Program Memory Size 4.063MB (4.063M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters -
Oscillator Type -
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 216-QFP
Supplier Device Package 216-TQFP
RoHS Status ROHS3 Compliant
Standard Package 400
ARM® Cortex®-M0+, ARM® Cortex®-M7F Traveo™ T2G Microcontroller IC 32-Bit Dual-Core 240MHz 4.063MB (4.063M x 8) FLASH 216-TQFP
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