Infineon Technologies CYW15G0403DXB-BGC
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| Parameters | |
|---|---|
| Mfr | Infineon Technologies |
| Series | HOTlink II™ |
| Package | Tray |
| Product Status | Obsolete |
| Function | - |
| Interface | - |
| Number of Circuits | 4 |
| Voltage - Supply | 3.135V ~ 3.465V |
| Current - Supply | - |
| Operating Temperature | - |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA Exposed Pad |
| Supplier Device Package | 256-L2BGA (27x27) |
| Base Product Number | CYW15G0403 |
| RoHS Status | RoHS non-compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 5A991B1 |
| HTSUS | 8542.39.0001 |
| Other Names | -CYW15G0403DXB |
| Standard Package | 40 |
Telecom IC 256-L2BGA (27x27)
