Infineon Technologies MB89191APF-G-XXX-BND-RE1

MB89191APF-G-XXX-BND-RE1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: MB89191APF-G-XXX-BND-RE1
  • Package: 28-SOIC (0.342", 8.69mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MB89191APF-G-XXX-BND-RE1(Kg)

Details

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Parameters
Program Memory Type Mask ROM
EEPROM Size -
RAM Size 128 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V
Data Converters A/D 8x8b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 28-SOIC (0.342", 8.69mm Width)
Supplier Device Package 28-SOP
Base Product Number MB89191
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
HTSUS 0000.00.0000
Standard Package 1
Mfr Infineon Technologies
Series F²MC-8L MB89190A
Package Tray
Product Status Obsolete
Core Processor F²MC-8L
Core Size 8-Bit
Speed 4.2MHz
Connectivity Serial I/O
Peripherals POR, WDT
Number of I/O 16
Program Memory Size 4KB (4K x 8)
F²MC-8L F²MC-8L MB89190A Microcontroller IC 8-Bit 4.2MHz 4KB (4K x 8) Mask ROM 28-SOP
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