Infineon Technologies MB90673PF-G-370-BND-BE1

MB90673PF-G-370-BND-BE1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: MB90673PF-G-370-BND-BE1
  • Package: 80-BQFP
  • Datasheet: -
  • Stock: In stock
  • Description: MB90673PF-G-370-BND-BE1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series F²MC-16LX MB90670
Package Tray
Product Status Obsolete
Core Processor F²MC-16L
Core Size 16-Bit
Speed 16MHz
Connectivity EBI/EMI, SCI, UART/USART
Peripherals POR, WDT
Number of I/O 65
Program Memory Size 48KB (48K x 8)
Program Memory Type Mask ROM
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 8x8/10b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 80-BQFP
Supplier Device Package 80-QFP (14x20)
Base Product Number MB90673
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
HTSUS 0000.00.0000
Standard Package 1
F²MC-16L F²MC-16LX MB90670 Microcontroller IC 16-Bit 16MHz 48KB (48K x 8) Mask ROM 80-QFP (14x20)
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