Infineon Technologies S29JL064J70TFI003

S29JL064J70TFI003


  • Manufacturer: Infineon Technologies
  • CONEVO NO: S29JL064J70TFI003
  • Package: 48-TFSOP (0.724
  • Datasheet: PDF
  • Stock: In stock
  • Description: S29JL064J70TFI003(Kg)

Details

Tags

Parameters
Series JL-J
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Mfr Infineon Technologies
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Technology FLASH - NOR
Supplier Device Package 48-TSOP
Access Time 70 ns
Memory Size 64Mbit
Memory Type Non-Volatile
Voltage - Supply 2.7V ~ 3.6V
Memory Organization 8M x 8, 4M x 16
Memory Format FLASH
Memory Interface Parallel
Write Cycle Time - Word, Page 70ns
Package Tape & Reel (TR)
Product Status Active
Base Product Number S29JL064
REACH Status REACH Unaffected
Standard Package 1,000
ECCN 3A991B1A
HTSUS 8542.32.0071

FLASH - NOR Memory IC 64Mbit Parallel 70 ns 48-TSOP


S29JL064J70TFI003 Description

The S29JL064J70TFI003 is a memory from Infineon Technologies. This non-volatile flash memory device has a mass storage capacity of 64Mbit, a parallel memory interface and a lightning-fast write cycle time of 70 nanoseconds. Its non-volatile nature allows data to be retained even in the event of a power outage, meeting critical data storage requirements. The electronic component needs to be operated in the operating voltage range of 2.7V to 3.6V and the operating temperature range of -40°C to 85°C for the most efficient use. The electronics are packaged in 48-TFSOP and the chip can be easily integrated into various electronic systems, ensuring seamless and efficient operation.


Features

Type: Memory IC

Memory Type: Non-Volatile

Memory Format: FLASH

Memory Size: 64Mbit

Voltage - Supply: 2.7V ~ 3.6V

Operating Temperature: -40°C ~ 85°C (TA)

Package / Case: 48-TFSOP

Mounting Type: Surface Mount


Applications

Industrial automation

telegraphy

Embedded systems,

Automatic assembly

Consumer electronics

Industrial equipment

Automotive application


Contact Information
close