Infineon Technologies TC275TP64F200NDCKXUMA1

TC275TP64F200NDCKXUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: TC275TP64F200NDCKXUMA1
  • Package: 176-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: TC275TP64F200NDCKXUMA1(Kg)

Details

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Parameters
Number of I/O 112
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 472K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 40x12b, 6 x Sigma-Delta
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Supplier Device Package PG-LQFP-176-22
Base Product Number TC275TP64
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Standard Package 500
Mfr Infineon Technologies
Series AURIX™
Package Tape & Reel (TR)
Product Status Active
Core Processor TriCore™
Core Size 32-Bit Tri-Core
Speed 200MHz
Connectivity ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals DMA, WDT
TriCore™ AURIX™ Microcontroller IC 32-Bit Tri-Core 200MHz 4MB (4M x 8) FLASH PG-LQFP-176-22
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