Infineon Technologies TC333LP32F300FAAKXUMA1

TC333LP32F300FAAKXUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: TC333LP32F300FAAKXUMA1
  • Package: 100-TQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Connectivity ASC, CANbus, FlexRay, LINbus, QSPI
Peripherals DMA, I²S, PWM, WDT
Program Memory Size 2MB (2M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 248K x 8
Voltage - Supply (Vcc/Vdd) 3.3V, 5V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 100-TQFP Exposed Pad
Supplier Device Package PG-TQFP-100-23
Base Product Number TC333LP32
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1,000
Mfr Infineon Technologies
Series AURIX™
Package Tape & Reel (TR)
Product Status Active
Core Processor TriCore™
Core Size 32-Bit Single-Core
Speed 300MHz
TriCore™ AURIX™ Microcontroller IC 32-Bit Single-Core 300MHz 2MB (2M x 8) FLASH PG-TQFP-100-23
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