Infineon Technologies TLE9461ESXUMA1

TLE9461ESXUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: TLE9461ESXUMA1
  • Package: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: TLE9461ESXUMA1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series Automotive, AEC-Q100, Lite SBC
Package Tape & Reel (TR)
Product Status Active
Conevo-Key Programmable Not Verified
Type System Basis Chip (SBC)
Applications CAN Automotive
Mounting Type Surface Mount
Package / Case 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package PG-TSDSO-24-1
Base Product Number TLE9461
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 3,000
System Basis Chip (SBC) PG-TSDSO-24-1
Contact Information
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