Infineon Technologies TLE9471ESV33XUMA1

TLE9471ESV33XUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: TLE9471ESV33XUMA1
  • Package: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: TLE9471ESV33XUMA1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series Automotive, AEC-Q100, Lite SBC
Package Tape & Reel (TR)
Product Status Active
Conevo-Key Programmable Not Verified
Type System Basis Chip (SBC)
Applications CAN Automotive
Mounting Type Surface Mount
Package / Case 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package PG-TSDSO-24-1
Base Product Number TLE9471
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 3,000
System Basis Chip (SBC) PG-TSDSO-24-1
Contact Information
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