Infineon Technologies XC2267M104F80LRABKXUMA1

XC2267M104F80LRABKXUMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: XC2267M104F80LRABKXUMA1
  • Package: 100-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC2267M104F80LRABKXUMA1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series XC22xxM
Package Tape & Reel (TR)
Product Status Not For New Designs
Core Processor C166SV2
Core Size 16/32-Bit
Speed 80MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals I²S, POR, PWM, WDT
Number of I/O 76
Program Memory Size 832KB (832K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 50K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 100-LQFP Exposed Pad
Supplier Device Package PG-LQFP-100-8
Base Product Number XC2267
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1,000
C166SV2 XC22xxM Microcontroller IC 16/32-Bit 80MHz 832KB (832K x 8) FLASH PG-LQFP-100-8
Contact Information
close