Infineon Technologies XC228796F66LACKXQMA1

XC228796F66LACKXQMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: XC228796F66LACKXQMA1
  • Package: 144-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: XC228796F66LACKXQMA1(Kg)

Details

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Parameters
Mfr Infineon Technologies
Series XC22xx
Package Tray
Product Status Not For New Designs
Core Processor C166SV2
Core Size 16/32-Bit
Speed 80MHz
Connectivity CANbus, EBI/EMI, FIFO, I²C, LINbus, QSPI, SPI, SSC, UART/USART, USI
Peripherals DMA, I²S, POR, PWM, WDT
Number of I/O 118
Program Memory Size 768KB (768K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 83K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 24x8/10/12b SAR
Oscillator Type External, Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package PG-LQFP-144-4
RoHS Status ROHS3 Compliant
REACH Status REACH Unaffected
Standard Package 360
C166SV2 XC22xx Microcontroller IC 16/32-Bit 80MHz 768KB (768K x 8) FLASH PG-LQFP-144-4
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