Infineon Technologies XE167F48F66LACFXQMA1

XE167F48F66LACFXQMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: XE167F48F66LACFXQMA1
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: XE167F48F66LACFXQMA1(Kg)

Details

Tags

Parameters
EEPROM Size -
RAM Size 34K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 24x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package PG-LQFP-144-4
Base Product Number XE167
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 360
Mfr Infineon Technologies
Series XE16x
Package Tray
Product Status Not For New Designs
Core Processor C166SV2
Core Size 16-Bit
Speed 66MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals I²S, POR, PWM, WDT
Number of I/O 118
Program Memory Size 384KB (384K x 8)
Program Memory Type FLASH
C166SV2 XE16x Microcontroller IC 16-Bit 66MHz 384KB (384K x 8) FLASH PG-LQFP-144-4
Contact Information
close