Infineon Technologies XE167G96F66LACFXQMA1

XE167G96F66LACFXQMA1


  • Manufacturer: Infineon Technologies
  • CONEVO NO: XE167G96F66LACFXQMA1
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: XE167G96F66LACFXQMA1(Kg)

Details

Tags

Parameters
Mfr Infineon Technologies
Series XE16x
Package Tray
Product Status Not For New Designs
Core Processor C166SV2
Core Size 16-Bit
Speed 66MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals I²S, POR, PWM, WDT
Number of I/O 118
Program Memory Size 768KB (768K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 82K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package PG-LQFP-144-4
Base Product Number XE167
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 360
C166SV2 XE16x Microcontroller IC 16-Bit 66MHz 768KB (768K x 8) FLASH PG-LQFP-144-4
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